| 真空镀膜机简介 |
| 添加时间：2019/8/13 15:37:32 浏览次数： |
| 简介 brief introduction 需要镀膜的被称为基片，镀的材料被称为靶材。 基片与靶材同在真空腔中。 The material that needs to be coated is called substrate, and the material that needs to be coated is called target. The substrate and the target are in a vacuum cavity. 蒸发镀膜一般是加热靶材使表面组分以原子团或离子形式被蒸发出来。并且沉降在基片表面，通过成膜过程（散点－岛状结构-迷走结构-层状生长）形成薄膜。 对于溅射类镀膜，可以简单理解为利用电子或高能激光轰击靶材，并使表面组分以原子团或离子形式被溅射出来，并且最终沉积在基片表面，经历成膜过程，最终形成薄膜。 Evaporation coating is generally used to heat the target material so that the surface components are evaporated in the form of atomic clusters or ions. The film is deposited on the surface of the substrate and formed by the film forming process (scatter-island structure-vagal structure-layered growth). For sputtering coating, it can be simply understood that the target is bombarded by electrons or high-energy laser, and the surface components are sputtered out in the form of atomic clusters or ions, and eventually deposited on the surface of the substrate, which undergoes the process of film formation and finally forms the film. |
| 上一页 真空镀膜和光学镀膜原理的区别 |
| 下一页 真空镀膜机使用步骤 |
Copyright © 技术支持：遨游网络