| 镀膜过程 |
| 添加时间：2019/9/24 15:08:26 浏览次数：1 |
| 需要镀膜的被成为基片，镀的材料被成为靶材。 基片与靶材同在真空腔中。 Substrates that need to be coated are made, and materials that need to be coated are made targets. The substrate and the target are in a vacuum cavity. 蒸发镀膜一般是加热靶材使表面组分以原子团或离子形式被蒸发出来，并且沉降在基片表面，通过成膜过程（散点－岛状结构-迷走结构-层状生长）形成薄膜。 对于溅射类镀膜，可以简单理解为利用电子或高能激光轰击靶材，并使表面组分以原子团或离子形式被溅射出来，并且最终沉积在基片表面，经历成膜过程，最终形成薄膜。 Evaporative coating usually heates the target to evaporate the surface components in the form of atoms or ions, and deposits on the surface of the substrate. The film is formed through the film forming process (scatter-island-vagal-layer growth). For sputtering coating, it can be simply understood that the target is bombarded by electrons or high-energy laser, and the surface components are sputtered out in the form of atomic clusters or ions, and eventually deposited on the surface of the substrate, which undergoes the process of film formation and finally forms the film. |
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